Frequently Used Product Development Acronyms

The product development process is filled with acronyms that can be confusing for both new and returning clients. We’ve compiled a list of some of the most commonly used acronyms to help you navigate the process.

Job Identification 

• EE (electrical engineering)  
• ID (industrial design)
• ME (mechanical engineering)
• PE (project engineering)
• PM (project / program management)

Design / Process / Marketing 

• CAD (computer aided design / drafting)
• CAE ( computer aided engineering) 
• CAM ( computer aided manufacturing) 
• DFA (design for assembly)
• DFAA (design for automated assembly)
• DOE (design of experiments)
• DVT (design verification test)
• EVT (engineering validation test)
• GD&T (Geometric dimensioning and tolerancing)
• IP (intellectual property)
• JV (joint venture)
• MVP (minimum viable product)
• PD (product development)
• POC (proof of concept)
• POP (point of purchase) 
• POS (point of sale) 
• PVT (pilot Verification test) 
• R&D (research & development)
• UI (user interface)
• UX (user experience) 
• VOC (voice of customer)

Prototyping 

• DLMS (direct metal laser sintering) 
• FDM (fused deposition modeling)
• RP (rapid prototype)
• SLA (stereo lithography)
• SLS ( selective laser sintering) 

Materials 

• ABS (acrylonitrile-butadiene-styrene copolymer)
• HDPE (high-density poly-ethylene)
• LDPE (low-density poly-ethylene)
• PA (poly-amide)
• PE (poly-ethylene)
• PET/PETE (poly-ethylene terephthalate)
• PLA (poly-lactic acid), a starch based, compostable plastic
• PP (poly-propylene)
• PS (poly-styrene)
• PVC (poly-vinyl chloride)

Manufacturing / Production 

• CFA (chemical foaming agent) 
• CFM (continuous flow manufacturing)
• CIM (computer integrated manufacturing)
• CM (chemical machining)
• CM (contract manufacturer) 
• CNC (computer numerically controlled)
• DAM (days after manufacturing)
• DFM (design for manufacturing) 
• DFMA (design for manufacturing and assembly)
• EDM (electrode discharge machining)
• EMS (environmental management systems) 
• FAP (first article production) 
• GUI (graphical user interface)
• HMI (human machine interface)
• HUD (heads up display) 
• JIT (just in time manufacturing)
• LP (lean production)
• Mcog’s (material cost of goods)
• MFG. (manufacturing)
• MRP (materials requirement planning) 
• ODM (original design manufacturer) 
• OEM (original equipment manufacturer) 
• PDM (product data management) 
• QA (quality assurance)
• QC (quality control) 
• ROI (return on investment) 
• SCM (supply chain management) 
• SOP (standard operational procedures) 
• SPC (statistical process control)  
• SQC (statistical quality control)
• SWOT (strengths, weaknesses, opportunities & threats) 
• TQM (total quality management)
• WIP (work in process)

Supply Chain 

• B2B (business to business)
• CALS (commerce at light speed)
• EFT (electronic fund transfer)
• FOB (freight on board)
• MOQ (minimum order quantity)
• PI (performa invoice)
• PI (performa invoice)
• RFP (request for price)
• RFP (request for price)
• RFQ (request for quote)
• RFQ (request for quote)
• SOW (statement of work) 

Testing / Standards 

• ANSI (American National Standards Institute)
• ASTM (American Society for Testing Standards)
• EU (European Union) 
• FDA (Food Drug Administration)
• NSF (National Sanitation Foundation)
• OSHA (Occupational Safety & Health Associations)
• UL (Underwriters Laboratories)

Electrical Engineering Terms

• BLE (BlueTooth low energy)
• GPS (global positioning system)
• IoT (internet of things)
• LCD (liquid crystal display)
• LED (light e-emitting diode)
• LiPo (lithium polymer) battery
• LoRA (long range spectrum) 
• MCU (micro controller unit) 
• MEMS (micro electrical-mechanical systems)
• NiCd (nickel cadmium) battery
• NiMH (nickel metal hydride)
• OLED (organic LED)
• USB (universal serial bus)